Two-step polishing progress and mechanism for polycrystalline diamond

We innovatively propose the use of thermal-assisted DFP to polishing of CVD polycrystalline diamond with low-speed, low-pressure. This process reduces the roughness (Rq) from 101 nm to 10 nm. Subsequently, a polishing liquid is formulated using K2FeO4, deionized water, glacial acetic acid, and W0.25 diamond abrasive for CMP, ultimately achieving a further reduction in Rq to 3.9 nm. This marks the first combination of DFP and CMP processes, providing a new approach to diamond polishing.